摘要
焊膏中焊料颗粒粒径尺寸和分布是选择焊膏型号的重要依据,因此准确测量焊膏中焊料粉末的粒径尺寸和分布尤为重要。测定焊料粉末的粒径尺寸和分布,可以利用高分辨率和具有明显图像衬度的扫描电镜背散射图像,经图像处理软件二值化后准确测量焊料粉末的尺寸,收集足够的数据来确定,这对优化焊膏的性能和后期应用具有重要的指导意义。
Particle size in solder paste and its distribution help to archive product grading,and play an important role in selecting paste model.Therefore,it is quite worthwhile to precisely measure the particle size and distribution in solder paste.In this paper,high-resolution scanning electron microscope images and binary processed electron backscattered images with high-contrast were used to clarify the size and distribution of solder paste particle.It is expected that,this would give guidance to the optimization and future applications of solder paste.
作者
史留学
姚康
何烜坤
Shi Liuxue;Yao Kang;He Xuankun(The 46th Research Institute,CETC,Tianjin 300220,China)
出处
《印制电路信息》
2021年第3期50-53,共4页
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