电子器件冷却用针翅散热器的散热性能数值模拟

Numerical Simulation of the Heat Dissipation Performance of Pin Fin Heat Sink for Electronic Devices Cooling

本文采用数值模拟方法研究了电子器件冷却常用的平直翅片散热器及五种针翅散热器的散热性能,对比分析了不同来流速度下,不同散热器的热阻和流阻特性,得出相比于圆柱针翅、方柱针翅、75°斜柱针翅和60°斜柱针翅,45°斜柱针翅的热阻最小,但是其流阻增幅更大;增加针翅翅片的厚度能够有效降低热阻,但是其流阻增幅也更大;因此在针翅结构设计过程中,应选用较薄的方柱针翅、75°斜柱针翅或60°斜柱针翅结构。

The heat dissipation performances of a plain fin heat sink and five different pin fin heat sinks were numerically investigated,which were usually applied for electronic devices cooling.The thermal resistance and the flow resistance for different heat sinks were comparatively studied under different flow rate.The results show that the oblique pin fin heat sink which has the angle of 45°obtains the minimum thermal resistance,while the flow resistance is greater.And increasing the thickness of the pin fin could reduce the thermal resistance of the oblique pin fin heat sink,while the flow resistance becomes worse.So when the oblique pin fin heat sink is applied for electronic devices cooling,the thin oblique pin fin heat sink with the angle of 60°,75°and 90°is preferred.