PCB波峰焊工艺离子清洁度分析

Ion cleanliness analysis of PCB wave soldering process

随着电子行业的迅速发展,电子产品的集成度越来越高,电路板行业越来越多的出现离子污染测试。但对于波峰焊后的半成品板,目前行业内还没有一个完善的对离子污染的管控要求。研究者通过优化波峰焊工艺参数和半成品放置时间进行试验验证,并采用离子色谱仪测试和评估,试验结果表明:波峰焊助焊剂的材料特性和助焊剂的喷涂量等对印制电路板表面离子污染度会产生很大影响,而喷雾工艺参数并非关键因素。研究为后续减少离子清洁度对印制电路板装配(PCBA)的影响提供方向。

With the rapid development of the electronics industry,the integration of electronic products is getting higher and higher,and ion pollution tests are increasingly appearing in the circuit board industry.However,for semi-finished boards after wave soldering,there is currently no complete control requirement for ion pollution in the industry.The researcher conducted experimental verification by optimizing the wave soldering process parameters and the placement time of semi-finished products,and used ion chromatography to test and evaluate.The experimental results showed that the material characteristics of wave soldering flux and the amount of flux sprayed on the printed circuit board surface The degree of contamination will have a great impact,and the spray process parameters are not a key factor.Provide direction for the subsequent reduction of the impact of ion cleanliness on printed circuit board assembly(PCBA).