硅通孔抛光液的研究进展

Research Progress of Through Silicon Via Slurry

硅通孔(TSV)技术是一种先进的封装技术,化学机械抛光(CMP)是集成电路TSV制作过程中的重要步骤之一,是可兼顾材料表面局部和全局平坦化的技术。抛光液是影响抛光表面质量和加工效率的关键因素,是CMP工艺中消耗品成本最大的部分。TSV抛光液主要包括铜膜抛光液和阻挡层抛光液,依据抛光速率和抛光质量(表面粗糙度、碟形坑修正等)的要求对其进行了分类讨论,概述了近年来TSV抛光液的研究进展,对其今后的研究重点和发展趋势进行了分析和预测,认为TSV抛光液应朝着抛光速率和抛光质量的优化、低成本、环境友好的方向发展。

Through silicon via(TSV)technology is an advanced packaging technology.Chemical mechanical polishing(CMP)is one of the important steps in the manufacturing process of integrated circuit TSV,and is a technology that can take into account the local and global planarization of material surface.Slurry is a critical factor affecting the quality of the polished surface and processing efficiency,and has become the most of the CMP process consumables cost.TSV slurries mainly include copper film slurry and barrier layer slurry.They are classified and discussed according to the requirements of poli-shing rate and polishing quality(surface roughness,dishing pit modification,etc.).The research progress of TSV slurries in recent years are reviewed,and the future research emphasis and development trends are analyzed and forecasted.It is believed that the TSV slurry should be developed in the direction of optimization of the polishing rate and polishing quality,low cost and environmental friendliness.