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基于超声导波的飞行器密封质量检测方法 被引量:1

Guided Wave-Based Aircrafts Seal Quality Inspection Method
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摘要 结构中超声导波的传播特性受其几何与物理性质影响,不完美接触界面的预紧力和接触面阻尼将影响导波到达时间与能量等信号特征。为了检测飞行器密封质量,提出一种基于超声导波信号特征的密封质量检测方法,该方法可以定位密封缺陷位置并区分密封缺陷类型。从理论角度分析不完美接触界面上导波的传播机理与信号特征影响因素,基于信号到达时间与能量两种特征的离群值提出两种衡量密封质量的评价因子。试验结果验证了密封质量检测方法的有效性,诊断结果与实际情况吻合,表明基于超声导波的密封质量监测方法可以表征结构密封质量的变化。 Structure of ultrasonic guided wave propagation characteristics was influenced by the geometry and physical properties,imperfect contact interface of pre-tightening force and the contact surface damping will influence the signal characteristics of guided wave arrival time and energy to monitor vehicle sealing quality.This paper put forward a kind of ultrasonic guided wave signal characteristics of the sealing quality monitoring methods,which can locate sealing defect position and distinguish sealing defect types to illustrate cover sealing performance and the correlation between ultrasonic guided wave signal characteristics,from the point of view of theoretical analysis of the imperfect contact interface on the transmission mechanism of guided wave and signal characteristics of influencing factors.The propagation mechanism of guided waves and the influencing factors of signal characteristics at the imperfect contact interface are analyzed theoreticallybased on the signal arrival time(TOF)and energy(E)differences between the two kinds of characteristics.The test results verify the effectiveness of the sealing quality detection method,and the diagnosis results are consistent with the actual situation,indicating that the sealing quality monitoring method based on ultrasonic guided wave can characterize the change of structural sealing quality.
作者 高东岳 徐颖珊 郭健 庞冬晫 GAO Dongyue;XU Yingshan;GUO Jian;PANG Dongzhuo(Sun Yat-Sen University, Guangzhou 510275, China;Beijing Aerospace Technology Institute, Beijing 100074, China)
出处 《兵器装备工程学报》 CAS CSCD 北大核心 2021年第2期229-233,共5页 Journal of Ordnance Equipment Engineering
基金 国家自然科学基金项目(51805068,51705242)。
关键词 飞行器 口盖密封状态 超声导波 压电陶瓷晶片传感器 aerospace vehicle covering cap sealing condition guided wave piezoelectric wafer sensor
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