半导体晶圆厂洁净室气态化学污染物测试及污染源分析

Gaseous chemical contaminant test and pollutant source analysis of semiconductor wafer clean-rooms

以我国某新建的半导体晶圆厂洁净室气态化学污染物测试结果为例,利用长期在线检测和现场实测相结合的方法,完成了从建造到洁净室空态运行的全过程测试,分析了安装化学过滤器前后、洁净室运行前室内气态化学污染状况的变化情况及环境控制效果。并对比了室外空气环境及运行前后污染物种类的不同,确定了洁净室不同气态化学污染物的污染源信息。测试发现,新风机组的化学过滤器实际去除效率仅仅达到50%,无法满足规范中70%的要求。而微电子洁净室的酸性污染物主要来自于室外空气,氨气浓度较高,来源于室外空气和水泥等建筑材料;凝结物的污染源主要是室内源,来自室内的装修材料、清洗剂及生产工艺材料。

Taking the test results of gaseous chemical contaminants in a newly built semiconductor wafer clean-room in China as an example,adopts the method of combining long-term online detection with field measurement to analyse the change of indoor pollution and environmental control effect before and after installing a chemical filter and during the span between building and running the clean-room.Compares with the outdoor air environment and the different types of contaminants before and after operation,and determines the source information of different gaseous chemical contaminants in the clean-room.Finds that the actual removal efficiency of the chemical filter of the outdoor air unit is only 50%,which can not meet the requirement of 70%in the specification.The acid contaminants in the microelectronic clean-room mainly come from the outdoor air,while the ammonia gas comes from the outdoor air and building materials,such as cement.The pollution source of condensate is mainly indoor source,from indoor decoration materials,cleaning agents and production process materials.