摘要
The past 20 years have witnessed the rapid growth of photonic integration circuits(PIC)technology,which has been warmly embraced by both academia and the industry.Powered by the advanced development in material growth,processing,and design capability,the PIC technology now covers multiple material platforms,including III–V(InP,GaAs),silicon,silica,lithium niobate on insulator(LNOI)polymer,etc.The integration level has evolved from a single functional device to thousands of components on-chip.The increase in the performance and the complexity of the PICs have become an energetic booster for communication and information technology.
