团簇离子枪对CH_(3)NH_(3)PbI_(3)钙钛矿薄膜的影响研究

Study on effect of cluster ion gun on CHNHPbI perovskite film

以氩离子团簇为溅射源,对采用一步旋涂法制备的CH_(3)NH_(3)PbI_(3)钙钛矿薄膜进行溅射实验,通过XPS分析检测样品表面Pb元素的价态变化。结果表明,新制备的钙钛矿薄膜材料表面没有检测出Pb^(0),而经过团簇离子枪溅射的样品中部分Pb^(2+)还原成Pb^(0),证明了氩离子团簇刻蚀对钙钛矿材料具有破坏作用。一方面,溅射时间的增加以及团簇离子枪能量的增大均会加大钙钛矿材料的损伤程度;另一方面,离子枪团簇规模大小与溅射损伤程度呈近抛物线关系。因此,在进行此类样品表面清洁时,应尽量减小离子枪能量和溅射时间,选择较小或较大的团簇规模以减少对样品的损伤。该研究对于钙钛矿样品在进行XPS检测和数据分析时具有参考价值。

Argon ion clusters sputtering experiments were performed on the CH_(3)NH_(3)PbI_(3) perovskite film prepared by one-step spin coating method and then XPS analysis was applied to detect the change of the valence state of Pb on the sample surface.The results demonstrated that part of the Pb^(2+) on the sample surface could be reduced to Pb^(0) proving for the first time that the cluster ion gun could destroy the perovskite materials.On one hand,increasing the sputtering time and the energy of cluster ion gun would lead to more serious damage to the perovskite film;on the other hand,the cluster size of ions also played an important role on the degree of surface damage.And the degree of sputtering damage against the cluster size of the ions were nearly parabolic.Smaller or bigger cluster size,lower ion gun energy and short sputtering time should be selected to reduce damage when cleaning the surface of such samples.This study may provide an important guide for XPS detection and data analysis of perovskite materials.