微波组件软钎焊中的阻焊工艺研究

Research on Soldering-resistance Technology in Soldering of Microwave Module

随着软钎焊工艺在微波组件制造中的广泛应用,为了满足高密度产品高标准多样化的焊接质量需求,对液态焊料流淌的控制成为一项现实的工艺难题,可以利用相应的阻焊技术来实现。针对生产过程中出现的问题,分析微波组件软钎焊中对于阻焊的特殊要求,指出现有常规阻焊胶应用面临的诸多问题,通过对比试验引进一种改进型阻焊胶,能有效保护产品非焊接区域,与无铅焊接工艺兼容性好,工艺操作简单高效,起到了良好的效果,满足了高可靠微波组件的要求。

With the wide application of soldering technology in the manufacture of microwave modules,and in order to meet the high standard and diverse soldering quality requirements of high-density products,the control of liquid solder flow has been becoming practical and technical problems,the control could be realized by using the corresponding soldering-resistant technology.In view of the problems in the productive process,the special requirements of soldering-resistant in the soldering of microwave module were analyzed,many problems in the application of conventional solder mask were pointed out.Through comparative tests,an improved type of solder mask was introduced,which could effectively protect the non-welding area of the product,and had good compatibility with the lead-free soldering.It was simple and efficient that the process operations,and it worked well and met the requirements of high reliability microwave modules.