摘要
本文应用ROSE/SEC法测试航空电子产品印制板组件(PCBA)的离子污染度,以测试结果反映水清洗效果,通过工序能力指数Cpk对工艺参数进行评价,同时运用统计过程控制(SPC)对清洗工序进行监控,实现对航空电子产品水清洗工艺清洗质量的提升。试验结果表明,降低PCBA相互遮挡面积可有效降低离子污染度。结合Xbar-S控制图监测、识别过程中可能出现的异常因素,可消除或提前预防由于异常因素引起质量问题,达到提升航空电子产品水清洗整体质量的效果。
ROCE/SEC ion contamination test method isapplied to reflect the cleaning effectofavionics printed circuit board assembly(PCBA).Process parameters areevaluated by complex process capability index Cpk value,and the cleaning process ismonitored by statistical process control,so as to improve the quality of avionics productscleaning process.The results show that reducing PCBAs shielding area can effectively reduce the ion contamination level.By using Xbar-S control chart detect and identify abnormal factors in the process,quality problems caused by abnormal factors can be eliminated in advance,so as to improve the quality of PCBA water cleaning process.
作者
丁诗炳
张德晓
DING Shi-bing;ZHANG De-xiao(China National Aeronautical Radio Electronics Research Institute,Shanghai 200241,China)
出处
《航空电子技术》
2021年第1期52-56,共5页
Avionics Technology
关键词
离子污染度
水清洗
Cpk值
统计过程控制
ion contamination
water cleaning
Cpk value
statistical process control