4×25 Gb/s光电收发一体模块封装的设计与实现

Design and implementation of 4×25 Gb/s photoelectiric transceivers module package

光电收发模块的性能对整个通信系统质量至关重要。设计一个包括光电器件、封装结构等参数的光电协同链路仿真系统,首先从系统封装方案、版图和信号完整性等方面进行设计优化,获得封装结构的电学参数;其次,对光电器件参数进行优化提取,并建立一个包括封装结构电学参数对系统的性能影响的光电协同的仿真链路,通过光电协同链路仿真提前对模块进行优化评估,确保光电混合集成系统满足要求;最后,进行模块的组装和测试。仿真结果表明:25 Gb/s信号源输入下,模块通过1 km光纤进行自发自收,在213-1码型下,模块的误码率在1E-15以下,总功率仅为3.6 W。

The performance of photoelectric transceiver module is very important to the whole communication system quality.An optoelectronic collaborative link simulation system including optoelectronic devices,packaging structure and other parameters is designed.Firstly,the electrical parameters of the package structure are obtained by optimizing the system package scheme,layout and signal integrity.Secondly,the photoelectric device parameters are optimized and an optoelectronic collaborative system is established which includes the influence of the electrical parameters of the packaging structure on the system performance simulation link,through the optoelectronic collaborative link simulation,the module is optimized and evaluated in advance to ensure that the optoelectronic hybrid integrated system meets the requirements.Finally,the module is assembled and tested.The simulation results show that under the input of 25 Gb/s signal source,the module carries out self receiving through 1 km optical fiber.Under the 213-1 code type,the error code of the module is less than 1E-15,and the total power is only 3.6 W.