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原位封装MEMS低温温度传感器

MEMS cryogenic temperature sensor with in-situ packaging
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摘要 针对高精度低温温度测量需求,提出一种基于氮氧化锆薄膜的微机电系统(MEMS)低温温度传感器。通过微加工工艺,将传感器制备与封装相结合,有效简化传统低温温度传感器的制备流程,缩小低温温度传感器尺寸。研制的低温温度传感器尺寸仅为3.2 mm×2.0 mm×0.73 mm,质量低于12 mg。通过颗粒碰撞噪声检测和显微结构观测,盖帽中的凸点结构和金属化空腔可有效提高传感器可靠性。制备得到的低温温度传感器通过低温测试平台进行标定,传感器适用于4.2~300 K之间的温度测量,特别是50 K以下时,传感器具有很高的灵敏度。通过磁场环境测试,表明传感器在磁场中具有很好的稳定性。 Aiming at the requirement of high precision cryogenic temperature measurement,a MEMS cryogenic temperature sensor based on zirconium oxynitride film is proposed.Through the micro-machining process,the sensor preparation and packaging are combined to effectively simplify the preparation process of the conventional low-temperature temperature sensor and reduce the size of the low-temperature temperature sensor.The prepared cryogenic temperature sensor has a size of only 3.2 mm×2.0 mm×0.73 mm and mass is less than 12 mg.Through the particle impact noise detection and microstructure observation,the bump structure and the metallized cavity in the cover plate can effectively improve the reliability of the sensor.The prepared cryogenic temperature sensor is calibrated by a low temperature test platform,and the sensor is suitable for temperature measurement between 4.2~300 K,especially when the temperature is below 50 K,the sensor has high sensitivity.The magnetic field environment test shows that the sensor has good stability in magnetic field.
作者 黎云 尤敏敏 林祖德 刘景全 LI Yun;YOU Minmin;LIN Zude;LIU Jingquan(School of Electronic Information and Electrical Engineering,Shanghai Jiao Tong University,Shanghai 200240,China)
出处 《传感器与微系统》 CSCD 北大核心 2021年第4期66-69,共4页 Transducer and Microsystem Technologies
关键词 低温温度传感器 封装 微机电系统(MEMS) cryogenic temperature sensor packaging micro-electro-mechanical-system(MEMS)
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