光掩膜石英玻璃基板的制造工艺概述

Manufacturing Process of Photomask Fused Silica Substrate

光掩膜石英玻璃基板是光掩膜技术中的上游产品,广泛应用于半导体和光学等领域。随着半导体器件的集成化发展,对光掩膜石英玻璃基板的技术要求也越来越高。为满足市场需求,光掩膜石英玻璃基板的制造工艺也在不断改进,包括材料石英锭的熔制、热加工和冷加工等工艺。本文对光掩膜石英玻璃基板主要的制造工艺作出探究,提出一套石英玻璃基板的生产工艺流程。该工艺流程在实际中验证了可行性,可以为光掩膜石英玻璃基板的生产与研制提供借鉴。

Photomask fused silica substrate,which is one of the upper stream products in photomask technology,is widely used in semiconductor and optics fields.With the development of integrated semiconductor devices,the technical requirements for photomask fused silica substrate are getting higher and higher.In order to meet the market demand,the manufacturing processes of photomask fused silica substrate including silica material melting,hot working process and cold working process,etc.are constantly improved.The main manufacturing processes of photomask silica substrate were investigated and a set of technological procedure of silica substrate production was put forward.This set of technological procedure has been proved to be feasible by manufacturing practice,so that it can provide theoretical guidance for the production and development of photomask silica substrate.