60 mm尺度CMOS图像传感器装片工艺技术研究

Die Attach Evaluation for Supper Large CMOS Image Sensor Chip Above 60 mm

为了在使用过程中得到高质量的图像,对CMOS图像传感器芯片的贴装精度、芯片倾斜度及装片胶的稳定性要严格控制。对一款60 mm尺度CMOS图像传感器芯片封装结构进行优化研究,进一步优化装片材料和装片工艺参数,解决了芯片倾斜和翘曲问题。芯片翘曲度在10μm以内,满足图像传感器对封装的技术要求以及可靠性要求。

Warpage of CMOS image sensor die are strictly controlled.In this paper,the die attach structure of a supper large imaging sensor chip is studied first,so as to further optimize the material properties of the adhesive through residual stress analysis.The best adhesive is selected by comparison of several common adhesives.Finally,the die attach process parameters are optimized.The die warpage is successfully controlled to be lower than 10μm,meeting the warpage requirement(<20μm)and reliability qualification.