基于LTCC的微流道散热技术

The Technology of Micro-Channel Heat Sink Based on LTCC

简要介绍了在低温共烧陶瓷(LTCC)基板中制作微流道结构对电路散热的必要性,建立3种不同结构微流道LTCC基板有限元模型并对其进行了热-流耦合仿真,分别分析不同结构、流体流速及进出口截面对散热性能的影响。基于仿真结果制备实物,实测结果表明14 W/cm2热流密度下最高温升124.3 K,在设定水流流速为0.012 m/s后温升降低到71.1 K,与仿真结果基本吻合,散热效果显著。

It is briefly introduced that the fabricating micro-channel structure in LTCC(low temperature co-fired ceramic)substrate is necessary for circuit heat dissipation.Three finite element models of micro-channel with different structures are established and thermal-fluid coupling simulations are performed on them.It is analyzed in this article that the influence of different structures,fluid flow rates and inlet and outlet cross-sections on the heat dissipation performance,and prepare real objects based on the simulation results.The actual measurement results show that the maximum temperature rises by 124.3 K at a heat flux density of 14 W/cm2,and rises by 71.1 K when the water flow velocity is set to 0.012 m/s,which are basically consistent with the simulation results.The heat dissipation effect is significant.