30CrMnSi/Cu/V/TC4电子束焊接试验研究

Experimetal research of electron beam welded 30CrMnSi/Cu/V/TC4 joint

使用Cu/V中间层实现了30CrMnSi合金钢与TC4钛合金的电子束焊接,探究了接头组织和性能特征。结果表明,通过添加Cu/V过渡层金属可以避免Ti-Fe元素的直接混合反应生成脆硬的金属间化合物。焊缝不同区域分布着不同组分及性能的特征相,靠近钢侧焊缝为偏聚形成的富Fe相与富Cu相,靠近钛侧焊缝在形成Ti-V固溶体的同时也形成了少量Ti-Cu金属间化合物。接头的抗拉强度最高为418 MPa,接头失效于焊缝与30CrMnSi母材界面处的熔合线位置。

Electron beam welding of 30CrMnSi alloy steel and TC4 titanium alloy was realized by Cu/V interlayer.Microstructure and mechanical properties of the joint were investigated.The results show that by adding Cu/V transition layer metal,the direct mixing of Ti-Fe elements and the brittle intermetallic compounds can be avoided.Characteristic phases of different components and properties are distributed in different areas of the weld.The weld near the steel side is a mixture of Fe-rich phase and Cu-rich phase.The weld near the titanium side forms Ti-V solid solution and also forms a small amount of Ti-Cu intermetallic compounds.The maximum tensile strength of the joint is 418 MPa,and the joint fails at the interface between the weld and 30CrMnSi base metal.