三维集成电路测试技术与故障诊断问题研究

Research on Test Technology and Fault Diagnosis of Three-Dimensional Integrated Circuit

随着集成电路技术的发展,以TSV技术为主要基础的三维集成电路的体积不断减小,对检测与诊断带来一定难度。从三维集成电路的概念和发展出发,简要阐述理论,并对相关测试技术的原理展开分析,提出一套用于故障检测的具体检测措施。以单种故障和多种故障两种情况下的开路故障及泄漏故障为例,采用PMOS管漏电流、电桥电路、环形振荡器和放电敏感电路等测试方案对故障电路进行实际检测。通过分析实测结果,推断故障成因,给出合理诊断,为三维集成电路的研究制造提供参考。

With the development of integrated circuit technology,the volume of 3 D integrated circuit based on TSV technology is decreasing,which brings some difficulties to detection and diagnosis.Starting from the concept and development of 3 D integrated circuit,through briefly expounding the theory and analyzing the principle of related testing technology,a set of concrete detection measures for fault detection is put forward.Taking the open fault and leakage fault under single fault and multiple faults as examples,the test schemes of PMOS leakage current,bridge circuit,ring oscillator and discharge sensitive circuit are used to detect the fault circuit.By analyzing the measured results,the fault causes are inferred and reasonable diagnosis is given,which provides reference for the research and manufacture of 3 D integrated circuits.