硼硅树脂增粘剂对电子、陶瓷硅胶性能的影响

Effect of the Borosilicone Resin Adhesion Promoter on the Properties of Electronic and Ceramic Silicone Encapsulant

以硼硅树脂(BSR)为增粘剂,制备了具有良好粘接性能的电子、陶瓷硅胶。研究了它对有机硅胶性能的影响。结果表明BSR可以明显提高有机硅胶的粘接性能。当BSR用量为1.0份时,有机硅胶的综合性能较好,对Al和PPA基材的粘接剪切强度分别为4.25MPa和2.06MPa,拉伸强度为3.67MPa,断裂伸长率为51%,邵氏D硬度为49,折射率为1.532,透光率为90%,粘度为2950mPa·s。

Electronic and ceramic silicone encapsulant with good adhesion was prepared with borosilicone resin(BSR)as adhesion promoter.The influence of BSR on the properties of silicone encapsulant were investigated.The results showed BSR could markedly improve the adhesion strength of silicone encapsulant.When the content of BSR was 1phr,silicone encapsulant possessed good comprehensive performance.The adhesion shear strength was 4.25MPa and 2.06MPa for Al and PPA substrate,respectively.The tensile strength was 3.67MPa,the elongation at break was 51%,the Shore D hardness was 49,the refractive index was 1.532,the transmittance was 90%,and the viscosity was 2950mPa·s.