熔融石英半球谐振子精密磨削工艺研究

Research on Precision Grinding Process of Fused Silica Hemispherical Resonator

半球谐振子是高精度半球谐振陀螺的核心部件,特征为熔融石英材料薄壁Ψ型复杂结构件,其加工方法和制造精度是制约陀螺性能和产量提升的技术瓶颈。为解决石英谐振子异形复杂球面加工难题,从工程应用出发综合考虑了谐振子加工参数要求,分析探讨了谐振子球面加工涉及的球面展成、轨迹磨削、磁流变抛光等工艺方法及技术可行性,提出了采用小直径球形砂轮的全包络轨迹磨削加工方法。研究结果表明,满足工程使用需求的谐振子加工后,内外球面圆度小于3μm,同心度小于2μm,表面粗糙度小于0.2μm,品质因数Q>1×10^(7),显著提高了半球谐振陀螺随机漂移精度。

The hemispherical resonator is the core component of high-precision hemispherical resonator gyroscope,which is characterized by thin-walledΨ-shaped complex structural parts of fused silica material.Its processing method and manufacturing accuracy are the technical bottlenecks restricting the accuracy improvement and production increased of the gyroscope.To solve the problem of complex spherical surface processing of quartz resonator,from the perspective of engineering applications,the processing parameter requirements of the resonator are comprehensively considered.Also,the process methods and technical feasibility of spherical surface formation,track grinding,magnetorheological polishing,etc.involved in the processing of the spherical surface of the resonator are analyzed and discussed.A process method of full envelope path grinding crafts with small diameter spherical grinding wheel is proposed.The research result indicates that after processing the resonator that meets the requirements of engineering,the roundness of the inner and outer spherical surfaces is less than 3μm,concentricity of inner and outer spheres is less than 2μm,the surface roughness of the inner and outer spherical surfaces is less than 0.2μm,and the quality factor Q is greater than 1×10^(7),which significantly improve the random drift accuracy of the hemispherical resonator gyroscope.