提高金丝球焊合格率的工艺研究

Study on the Technology of Improving the Yield of Gold Wire Ball Welding

金丝键合是微组装制造工艺的关键工序,为解决电子产品金丝球焊合格率低的问题,根据金丝球焊的键合原理和工作过程,选取了键合压力、超声功率、超声时间、加热台温度等关键因素进行分析,得出金丝球焊是多种因素作用实现的,确定了设备的最优参数,并提出了改善金丝球焊工艺的方法。

Gold wire bonding is the key process in microassembly manufacturing process,to solve the problem of low yield of gold wire ball welding of electronic products,according to the bonding principle and working process of gold wire ball welding,analysis the key factors such as bonding pressure,ultrasonic power,ultrasonic time and heating table temperature,it is concluded that the gold wire ball welding is realized by many factors,the optimal parameters of the equipment are determined,the method of improving the gold wire ball welding process is also put forward.