摘要
In the present study,we offer an in-depth analysis over the microstructure,thickness and product composition of the interfacial reaction layer generated upon CBN/Cu-Sn-Ti active filler metal at 1223 K.Current findings demonstrate that adequate wettability and satisfactory bonding have been achieved via chemical reactions between Ti and N,B.More importantly,we report,for the first time,the formation of a three-layer juxtaposition of reaction products,namely,TiN,TiB2 and TiB,along the diffusion path of Ti.Meanwhile,we determine the average layer thickness to be 1.24 μm.Through deep etching,we unambiguously present morphologies of the newly formed TiN and TiB2,which are columnar and bulky,re spectively,and constitute the formation of a high strength metallu rgical interfacial bonding layer,and is crucial towards gaining enhanced grinding performance.Finally,we propose a possible reaction sequence and mechanism that govern the nucleation and growth of corre s ponding crystals.
基金
financially supported by the National Natural Science Foundation of China (Nos.51622401,51861130361,51861145312 and 51850410522)
the Newton Advanced Fellowship by Royal Society (No.RP12G0414)
the Research Fund for Central Universities (Nos.N172502004 and N2025025)
the Xing Liao Talents Program (Nos.XLYC1807024 and XLYC1802024)
the NEU Innovation Team Project
the Global Talents Recruitment Program endowed by the Chinese Government
State Key Laboratory of Solidification Processing,Northwestern Polytechnical University (No.SKLSP201805)。
