摘要
简述意法半导体ST的高边驱动芯片的仿真与选型原理,阐明ST高边驱动芯片的仿真与应用,以及介绍经过负载模型的仿真后进行可靠性分析的原理。
This paper briefly introduces the simulation and selection principle of ST high side driver chip,expounds the simulation and application of ST high side driver chip,and introduces the principle of reliability analysis after load model simulation.
作者
江凯敏
徐伟
陈文庆
朱光欢
JIANG Kai-min;XU Wei;CHEN Wen-qing;ZHU Guang-huan(Automotive Engineering Research Institute of Guangzhou Automobile Group Co.,Ltd.,Guangzhou 511434,China)
出处
《汽车电器》
2021年第4期71-74,共4页
Auto Electric Parts
关键词
高边驱动
ST
仿真与选型
high side driver
ST
simulation and model selection
