期刊文献+

基站设备断电节能凝露现象的研究 被引量:1

Research on condensation phenomenon during energy-saving shutdown of base station
下载PDF
导出
摘要 5G基站多收发通道数、宽带宽、高流量、高发射功率等特性,导致其满载功耗较4G基站大幅增加。5G发展初期,现网基站可能存在长时间无用户的场景,对无用户基站设备进行间隔断电起到节能的效果。间隔断电节能也会带来设备凝露,引起器件、PCB等腐蚀、烧毁,造成基站设备失效。介绍了凝露的基本原理,设计了凝露实验并对基站设备进行对比验证,分析了基站设备产生凝露的原因,最后给出了基站设备避免凝露的使用方案建议。 5G base station has a significant increase in its full-load power consumption compared to 4G base stations due to multiple transceiver channels,wide bandwidth,high traffic and high transmission power.In the early stage of 5G development,since there may be scenarios without users for a long time in the current network base stations,intermittent shutdown of the base stations can play a role in energy saving.However,the intermittent shutdown of the base station saves energy and condensation occurs inside the equipment,which will cause corrosion and burn down of devices and PCB,resulting in the failure of base station equipment.The basic principle of condensation was introduced,the condensation experiment was designed and the comparative verification was carried onto the base station equipment,the causes of condensation on the base station equipment were analyzed,and finally the suggestion for the use scheme of the base station equipment to avoid condensation was given.
作者 付吉祥 张瑞艳 张敏 陶琳 邓伟 FU Jixiang;ZHANG Ruiyan;ZHANG Min;TAO Lin;DENG Wei(China Mobile Research Institute,Beijing 100053,China)
出处 《电信科学》 2021年第4期108-115,共8页 Telecommunications Science
关键词 5G 基站设备 凝露 间隔断电 深度休眠 5G base station equipment condensation intermittent shutdown deep sleep
  • 相关文献

参考文献8

二级参考文献33

  • 1郎松军.建筑结露的起因和防治方法初探[J].四川建筑,2002(z1):201-203. 被引量:2
  • 2徐红.海用露天电子设备防凝露设计概述[J].电子机械工程,2004,20(3):24-26. 被引量:10
  • 3冯彩松.船用光端机“三防”设计[J].光纤与电缆及其应用技术,1994(3):19-23. 被引量:2
  • 4冯乃谦,李桂芝,邢锋.调湿材料的研究[J].新型建筑材料,1994,21(6):16-19. 被引量:21
  • 5龚光福,曹立荣.雷达产品的防护设计和防护技术[J].雷达科学与技术,2006,4(4):249-256. 被引量:6
  • 6山田稚士.建筑结露[M].孙逸增,译.北京:中国建筑工业出版社,1987.
  • 7HOGE C E. Corrosion criteria for electronic packaging, Part A: framework for corrosion of integrated circuits [ J ]. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1990, 13(4): 1090-1097.
  • 8KLINGER D J. Humidity acceleration factor for plastic pack- aged electronic devices[J]. Quality and Reliability Engineer- ing International, 1991,7 (5) : 365-370.
  • 9YAN B D, MEILINK S, WARREN G, et al. Water adsorp- tion and surface conductivity measurements on a-alumina substrates[ J ]. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1987, 10(2) : 247-251.
  • 10TENCER M , MOSS J S. Humidity management of outdoor electronic equipment: methods, pitfalls and recommenda-tions[ J ]. IEEE Transactions on Components and Packaging Technologies, 2002, 25 ( 1 ) : 66-72.

共引文献93

同被引文献4

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部