聚合物真空绝缘子表面混合溶剂造孔研究

Pore-forming on the surface of polymer vacuum insulator by mixed solvent

为提高聚合物绝缘子的真空沿面绝缘性能与耐压稳定性,利用有机溶剂-水混合体系与聚合物材料的相互作用,对聚合物表面造孔的方法及其对聚合物绝缘子真空沿面闪络性能的影响进行探究。选用聚醚酰亚胺为研究对象,利用有机溶剂-水混合溶剂对绝缘子表面进行处理:有机溶剂将水分子带入聚合物表层,而后除去溶剂,在此过程中,侵蚀聚合物表面的混合溶剂中有机溶剂首先挥发,残留的水分子由于与聚合物不相容,团聚成小液珠,占据一定的空间,最后随着水珠被真空热处理去除,在聚合物绝缘子表面形成了微孔结构。通过该处理的聚合物绝缘子的表面化学成分基本不发生变化。对混合溶剂造孔的聚酰亚胺绝缘子进行短脉冲闪络电压测试,结果表明,通过合适配比的混合溶剂造孔能使绝缘子闪络电压得到有效提升。该方法简单易行,适用于各种几何结构与尺寸的聚合物绝缘子。

To improve the surface vacuum insulating characteristics and the voltage withstand stability of the polymer insulator,pore-forming method on the surface of polymer insulators and its influence on the vacuum surface flashover voltages are studied by investigating the interaction between organic solvent-water mixed solvent and polymer materials.The organic solvent-water mixed solvent is applied to dispose the surface of the insulating material―polyetherimide.In the process,with the help of the organic solvent,water molecule is taken into the surface layer of the polymer.In the next solventremove process,the organic solvent is easy to get out of the polymer,leaving water molecule reuniting to water drops and occupying certain space in the body of the polymer.Finally,with the evaporation of the residual water drops under vacuum thermal treatment,micro holes are formed on the surface of the treated polymer insulator with chemical component unchanged.The results of the short-pulsed high-voltage test of the treated insulators indicate that the surface flashover voltages of the insulators increase effectively through the mixed solvent pore-forming treatment with proper organic solvent-water ratio.The method to create micro holes on the surface of polymer insulator is easy and appropriate to insulators with different geometric structures and scales.