芯片技术反向外包影响因素分析及对策研究

An Analysis of the Influencing Factors and the Countermeasures of the Chip Technology Reverse Outsourcing

在国际贸易保护主义有所抬头的背景下,中兴、华为遭美制裁等事件表明:对芯片技术反向外包影响因素进行分析并找寻相关对策极为重要。就分析方法而言,由于模糊层次分析方法受主观影响大、一致性判别存在困难等原因,需要用改进的布谷鸟模糊层次分析法对芯片技术反向外包影响因素加以实证评估并进行重要性排序。就应对策略来说,国际贸易磋商、顶层设计与基层设计相结合、注重芯片人才培养、“一带一路”倡议联盟等,皆是需要考量的重要因素。

Under the background of international trade protectionism, the sanctions against ZTE and Huawei imposed by the US confirmed the importance of analyzing the influencing factors of chip technology reverse outsourcing and finding out the countermeasures. Since the FAHP is greatly influenced by subjective factors and weak in judging the consistency, as to the analytical method, an improved CS-FAHP algorithm is proposed to empirically evaluate the importance of the influencing factors in this paper. The corresponding suggestions are given in terms of the international trade consultation, combination of top-level and basic level designs, chip talent training and "the belt and road" initiative alliance.