工控机芯片塑封精密压注成型CAE优化分析

CAE Optimization Analysis of Precision Injection Molding for Plastic Packaging of Industrial Computer Chip

应用热固性树脂对某计算机IC芯片的进行塑封封装精密压注成型。对塑封工艺中出现的品质缺陷问题,结合CAE分析,采用工艺优化后的3个措施对芯片进行塑封,芯片得到较好的塑封效果,进行工艺优化的3个措施为:优化的压注工艺参数、合理的压注室位置、增设流动末端溢流槽。优化的工艺参数为:模具温度为180℃、进料温度为50℃、保压控制分别为20 MPa-10 s、15 MPa-5 s、5 MPa-5 s、固化时间为30 s、环境温度为25℃、转移缸温度为180℃、转移延迟时间为5 s。压注室在进行一定距离的偏心设置优化及流动末端设置溢流槽后,塑封体内的气孔得到有效移除,熔接线的数量减少,且发生位置能控制在塑封体外。CAE晶片位移结果表明,采用特种固晶锡膏对晶片进行固定,使充填时晶片的偏移量小,同时在塑封时,金线不会产生金线短路和金线交错的问题。

A computer IC chip was molded with thermosetting resin.In view of the quality defects in the plastic sealing process,combined with CAE analysis,the chip could get very good plastic sealing effect after adopting the three measures of process optimization,the three measures of process optimization were:Optimized injection process parameters,reasonable injection chamber location,added flow end overflow slot.The optimized process parameters were:mold temperature 180℃,material temperature 50℃,pressure maintaining control 20 MPa-10 s,15 MPa-5 s,5 MPa-5 s,curing time 30 s,ambient temperature 25℃,transfer cylinder temperature 180℃,transfer delay time 5 s.After a certain distance of eccentric setting optimization in the injection chamber and overflow tank at the flow end,the pores in the plastic body could be effectively removed,the number of fusion lines could be reduced,and the occurrence position could be effectively controlled outside the plastic body.The displacement of CAE wafer showed that the special solid solder paste was used to fix the wafer,the offset of the wafer was small when filling,and the gold wire would not had the problem of gold wire short circuit and gold wire interleaving when plastic sealing.