期刊文献+

试论集成电路失效分析中电测试的应用

On the application of electrical test in IC failure analysis
下载PDF
导出
摘要 电测试是对集成电路进行失效分析的重要内容之一,在集成电路失效分析测试中具有十分重要的作用,采用合理的电测试方式,可以简化集成电路的失效分析过程,提高失效分析的测试效率。通过对集成电路失效分析的基本方法进行分析,探究了集成电路失效分析中仪器设备的具体应用,并分析了集成电路的印刷电路的失效性能。 Electrical testing is one of the important contents of failure analysis for integrated circuits,which plays a very important role in the failure analysis and testing of integrated circuits.Adopting a reasonable electrical testing method can simplify the failure analysis process of integrated circuits and improve the test efficiency of failure analysis.Through the analysis of the basic methods of integrated circuit failure analysis,this paper explores the specific application of instruments and equipment in integrated circuit failure analysis,and analyzes the failure performance of printed circuit of integrated circuit.
作者 周长 Zhou Chang(Guangzhou Mechanical and electrical senior technical school,Guangzhou Guangdong,510000)
出处 《电子测试》 2021年第8期106-107,共2页 Electronic Test
关键词 集成电路 失效分析 电测试 integrated circuit failure analysis electrical test
  • 相关文献

参考文献4

二级参考文献22

  • 1陈兆轶,方培源,王家楫.CMOS器件及其结构缺陷的显微红外发光现象研究[J].固体电子学研究与进展,2006,26(4):460-465. 被引量:6
  • 2Hao Y,Zhu J G. The gate-oxide breakdown effect couple by channel hot-carrier-effect in SOI MOSFET's [J]. Chinese Journal of Electronics, 2001,10 (2) : 204- 209.
  • 3Liu H, Hao Y. A unity oxide breakdown moudel for thin gate MOS devices[C]. International Conference on Solid-state Integrated Circuit, 2001: 1006-1009.
  • 4Joh N J,Hong K B. IDDQ testing-conceptual idea and application in LED integrated with IC module[C]. International Symposium for Testing and Failure Analysis, 2004: 213-223.
  • 5Dumin D J. Oxide wearout, breakdown, and reliability [J]. International Journal of High Speed Electronics and System, 2001, 11(3): 617-621.
  • 6Yassine A, Nariman H E, Olasupo K. Field and temperature dependenee of TDDB of ultrathin gate oxide [J]. IEEE Electron Device Letters, 1999, 20 (8): 390-392.
  • 7[美]韦克利(WAKERLYJF).Digitaldesign:prinei-plesandpractices[M].3rded.北京:高等教育出版社,2007.
  • 8Baozhen L, Christiansen C, Badami D, et al. Electromigration Challenges for Advanced on-chip CuInterconnects[J]. Microelectronics Reliability, 2014, 54(4): 712-724.
  • 9Lall P, Lowe R, Goebel K. Comparison of prognostic health management algorithms for assessment of electronic interconnect reliability[C]. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Burlingame, CA, United states, July 16 - July 18, 2013. A019-A029.
  • 10Ramakrishnan Arun, Pecht Michael G. A Life Consumption Monitoring Methodology for Electronic Systems[J]. IEEE Transactions on Components and Packaging Technologies, 2003, 26(3): 625-634.

共引文献18

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部