芯片封装自动化测量与识别系统

Automatic measurement and identification system for chip packaging

同样的芯片封装,提供给用户的型号都会因为内部细节上的差异有所不同,这些细微的差异如果用人工识别、分拣,是很难完成的任务。特别是对于日趋小型化的芯片,人工识别和分拣更是费时费力的过程,所以构建自动化的芯片识别系统是芯片封装领域的新趋势。

For the same chip package,the models provided to users will be different because of the differences in internal details.If these subtle differences are identified and sorted manually,it is very difficult to complete the task.Chip sorting is becoming more and more time-consuming,especially in the field of chip packaging automation.