一种高性能FPGA辐射发射抑制方法研究

A radiation emission suppression method of high-performance FPGA

随着半导体技术的不断发展,集成电路的电路速度、集成密度和I/O端口数量已大大增加,FPGA的小型化、高密度集成会引发电磁兼容性的问题,电磁屏蔽是抑制电磁辐射最有效的方法,选择高效的电磁屏蔽材料可以取得良好的屏蔽效果。而目前电磁屏蔽材料在FPGA上的应用较少,因此选取了一款具有代表性的高性能FPGA作为研究对象,通过近场扫描测试来研究不同状态下FPGA的电磁辐射发射问题;针对芯片的特点,选取了复合金属屏蔽罩和吸波导电海绵作为电磁屏蔽材料,对FPGA的辐射发射进行抑制。进一步的实验结果表明,由金属材料复合而成的屏蔽罩具有更好的屏蔽效能,达到了10 dBm,相比之下,吸波导电海绵的压缩性和结构稳定性更有助于FPGA在多场景下应用。

With the continuous development of semiconductor technology,the circuit speed,integration density and the number of I/O ports of integrated circuits have greatly increased.The miniaturization and high-density integration of FPGAs will cause electromagnetic compatibility problems.Electromagnetic shielding is the most effective way to suppress the electromagnetic radiation.Choosing efficient electromagnetic shielding materials can achieve good shielding effects.At present,electromagnetic shielding materials are rarely used in FPGA,so we select a representative high-performance FPGA as the research object,and study its electromagnetic emission in different program states through near field scanning experiment.According to the characteristics of the chip,the composite metal shield and the absorbent waveguide electric sponge are selected as the electromagnetic shielding materials to suppress the radiation emission of FPGA.Through further verification and analysis in experiments,the results show that the shield made of metal composite has better shielding effectiveness,and reaches 10 dBm.In contrast,the compressibility and structural stability of the wave-absorbing conductive sponge are more conducive to the application of FPGA in multiple scenarios.