QFP封装焊点随机振动分析与优化

Analysis and Optimization of Random Vibration of QFP Package Solder Joints

随着电子产品与系统的日益复杂化,利用仿真的手段来解决产品尚处在研发阶段的可靠性问题已成为产品可靠性设计的重要一环。来源于实际的含QFP封装器件的工程案例单板,对QFP封装的引脚和焊点进行详细建模,利用ANSYS Workbench对QFP封装焊点进行了随机振动分析,确定焊点的应力分布及危险焊点所在位置。根据随机振动仿真结果,对QFP封装进行优化和改进,并将改进后的数字样机进行仿真验证,验证结果表明改进措施有效减小了QFP焊点的等效应力。

With the increasing complexity of electronic products and systems,it has become an important part of product reliability design to use simulation to solve the reliability problem of products in the research and development stage.Derived from the actual engineering case board containing QFP packaged devices,the QFP package pins and solder joints are modeled in detail,and random vibration analysis of QFP package solder joints is performed using ANSYS Workbench to determine the stress distribution and danger of solder joints where the solder joints are located.According to the random vibration simulation results,the QFP package is optimized and improved,and the improved digital prototype is simulated and verified.The verification results show that the improvement measures effectively reduce the equivalent stress of the QFP solder joints.