摘要
高可靠集成电路多采用AuSn20焊料完成密封,在熔焊过程中焊缝区域往往产生密封空洞,这对电路的气密性和盖板焊接强度产生影响,从而造成可靠性隐患。介绍了Au Sn20焊料密封陶瓷外壳的过程,阐述了两种从不同方向制样和观察密封空洞的方法,列举了环状空洞、扇形空洞、气泡状空洞等几种典型空洞,并阐述了这几种空洞的微观形貌、形成机理及抑制措施。
For highly reliable integrated circuits,Au Sn20 solder is often used to complete the sealing.Sealing voids are often generated in the weld area during the fusion welding process,which affects the air tightness of the circuit and the welding strength of the cover plate,thereby causing reliability risks.Au Sn20 sealing is introduced.The process of the ceramic shell expounds two methods of sample preparation and observation of sealing voids from different directions.Several typical voids such as ring voids,fan-shaped voids and bubble-like voids are listed,and the microscopic appearance formation mechanism and suppression measures of these voids are explained.
作者
马艳艳
赵鹤然
田爱民
康敏
李莉莹
曹丽华
MA Yanyan;ZHAO Heran;TIAN Aimin;KANG Min;LI Liying;CAO Lihua(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China;School of Information and Electrical Engineering,Shenyang Agricultural University,Shenyang 110866,China;Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China)
出处
《电子与封装》
2021年第5期30-34,共5页
Electronics & Packaging
基金
国防科工局技术基础科研项目(JSZL2017210B015)。
关键词
密封
空洞
金锡合金
焊料
sealing
void
gold-tin alloy
solder
