印制电路板加工中孔内与板面除胶差异研究

Study on the difference of desmear between inside hole and surface in PCB processing

文章通过对比研究基材板面和孔内除胶速率、SEM形貌的差异,找出板面和孔内除胶的关系和规律,通过表面除胶速率推算PCB需要的除胶条件,使除胶条件的选择更科学合理,同时对除胶速率片的选择提出建议。

The difference of desmear rate and SEM appearance between surface and hole is studied to find out the relationship and law,by calculating the desmear condition of PCB based on surface desmear rate which is more scientific and reasonable.Some suggestions are put forward for the selection of desmear rate testing sample.