摘要
由于低成本和高集成度的要求,汽车工业级器件在航空航天领域得到了的应用,汽车工业级器件在航空航天应用面临的首要问题是工作温度范围无法满足"军温"的要求。因此,需要开展汽车工业级元器件低温拓展应用的相关技术研究,分析器件低温拓展应用时的性能变化,指导汽车工业级元器件低温应用时的设计。论文调研了国内外相关研究,研究了元器件低温应用失效机理,设计了一种元器件低温特性验证极限应力试验方案,采用在集成电路测试系统上联合温度罩杯的方案,实现了对复杂集成电路0~-80℃温度范围的低温试验。
Due to the requirements of low cost and high level of integration,automotive industrial components have been used in aerospace field.The primary problem automotive industrial components facing in aerospace field applications is the operating tem⁃perature range which cannot meet the requirements of"military temperature".Therefore,it is necessary to carry out relevant techni⁃cal research on the low-temperature expansion application of automotive industrial components,analyze the performance changes of the low-temperature expansion application of components and guide the design of the low-temperature application of automotive in⁃dustrial components.In this paper,domestic and foreign research are investigated,the failure mechanism of cryogenic application of components is studied,and a test scheme for ultimate stress verification of cryogenic characteristics of components is designed.The scheme of combined temperature cup on the integrated circuit test system is adopted to realize the low-temperature test for com⁃plex integrated circuits in the temperature range of 0~-80℃.
作者
许艳君
李智
闫玉波
XU Yanjun;LI Zhi;YAN Yubo(Beijing Zhenxing Institute of Metrology and Measurement,Beijing 100074)
出处
《计算机与数字工程》
2021年第4期659-663,共5页
Computer & Digital Engineering
关键词
元器件可靠性
低温应用
应力试验
半导体器件
component reliability
low temperature application
stress test
semiconductor