基于Icepak的电源插件散热仿真分析

Heat Simulation Analysis of Power Plug-In Based on Icepak

电源插件AC/DC电源模块工作时,发热量较大,因此本文采用SolidWorks软件对电源模块插件进行建模并采用ANSYS Icepak软件进行散热性能模拟分析,根据模拟结果得出:AC/DC电源模块本身发热较为严重,增加散热片后,在额定工作状态下,插件内AC/DC电源模块最高温度降低,但插件内其它器件温度变化较小。增加散热孔后,插件内部空间及所有器件温度均降低,散热孔开孔率越大,散热性能越好。同时采用散热片和散热孔后,电源插件内部AC/DC模块温度降低12.31℃,DC/DC模块温度降低8℃,印制板温度降低12.27℃,插件散热性能提升。仿真模拟结果为插件散热性能分析提供重要参考依据,为插件散热性能优化提供设计思路。

When power plug-in works,the heat of the AC/DC power module is large,SolidWorks is used to build the power module plug-in module and ANSYS Icepak is used to simulate and analyze the heat dissipation performance.According to the simulation results,it is concluded that:The heating of AC/DC power module is serious,after adding heat sink,the maximum temperature of AC/DC power module in the plug-in decreases,but the temperature change of other devices in the plug-in is small.With the increase of cooling holes,the internal space of the plug-in and the temperature of all devices are reduced.The heat dissipation performance is the better when the opening rate of the cooling hole larger.The results show that the temperature of AC/DC module decreases by 12.31℃,the temperature of DC/DC module decreases by 8%,and the temperature of printed board decreases by 12.27℃after using heat sink and cooling hole.The simulation results provide an important reference for the thermal performance analysis of the plug-in,and provide design ideas for the thermal performance optimization of the plug-in.