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Ag-Cu-Ti+W复合钎料钎焊SiC陶瓷的接头性能研究 被引量:1

Properties of the joint of Si C ceramics brazed by Ag-Cu-Ti+W composite filler
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摘要 通过使用Ag-Cu-Ti钎料钎焊,可以实现Si C陶瓷的有效连接,但它与陶瓷母材热膨胀系数相差较大,钎焊降温过程中会产生较大的残余应力。通过向Ag-26.7Cu-4.5Ti钎料中复合不同体积分数的W颗粒,调节钎料的热膨胀系数,使之更接近于母材。通过改变钎焊温度和保温时间,研究工艺参数对焊缝的显微组织和力学性能的影响。结果表明,W颗粒均匀分布在基体中且未与其他元素反应。当添加合适的体积分数的W颗粒,并且在适当的钎焊温度和保温时间下,能够形成组织均匀、连接良好的复合接头。当添加的W的体积分数为10%,在钎焊温度为807 ℃、保温时间为10 min的条件下,可获得高剪切强度为95.05 MPa。 The effective connection of Si C ceramics can be achieved through the brazing with Ag-Cu-Ti filler.A large residual stress is caused in the cooling process of brazing due to a big difference of thermal expansion coefficient between the filler and Si C ceramic.In this article,the thermal expansion coefficient of Ag-26.7 Cu-4.5 Ti filler is adjusted by adding W particles with different volume fraction to make it closer to Si C ceramics.The influence of brazing parameters on microstructure and mechanical properties of weld is studied by changing brazing temperature and holding time.The results show that W particles are uniformly distributed in the matrix and do not react with other elements.When adding a suitable volume fraction of W particles,a composite joint with uniform microstructure and good connection is formed under an appropriate brazing temperature and holding time.When the adding volume fraction of W is 10%,the maximum shear strength of 95.05 MPa is obtained at 807℃for 10 min.
作者 张超 侯桂贤 钟志宏 王志泉 ZHANG Chao;HOU Guixian;ZHONG Zhihong;WANG Zhi-quan(School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China)
出处 《电焊机》 2021年第5期97-102,I0007,共7页 Electric Welding Machine
基金 国家磁约束核聚变能发展研究专项(2015GB121003)。
关键词 SIC陶瓷 钎焊 Ag-Cu-Ti+W复合钎料 剪切强度 SiC ceramics brazing Ag-Cu-Ti+W composite filler shear strength
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  • 1吴宜灿,汪卫华,刘松林,李静惊,王红艳,陈红丽,陈明亮,张士杰,黄群英,黄德所,郑善良,曾勤,胡丽琴,柏云清,章毛连,李艳芬,李春京,冯岩,宋勇,龙鹏成,FDS课题组.聚变发电反应堆概念设计研究[J].核科学与工程,2005,25(1):76-85. 被引量:47
  • 2刘松林,汪卫华,龙鹏程,吴宜灿.聚变发电反应堆双冷液态锂铅包层模块结构设计与分析[J].核科学与工程,2005,25(1):91-96. 被引量:1
  • 3吴宜灿,汪卫华,刘松林,黄群英,郑善良,王红艳,陈红丽,陈明亮,柏云清,宋勇,章毛连,柯严,李春京,李艳芬,胡丽琴,刘萍,李静惊,李莹,许德政,曾勤,陈义学.ITER中国液态锂铅实验包层模块设计研究与实验策略[J].核科学与工程,2005,25(4):347-360. 被引量:47
  • 4虞觉奇 易文质 陈邦迪.二元合金状态图集[M].上海:上海科学技术出版社,1984.574.
  • 5AKSELSEN O M. Advances in brazing of ceramics[J]. Journal of Materials Science, 1992, 27:1989-2000.
  • 6VILLARS P, PRINCE A, OKAMOTO H. Handbooks of Ternary Alloy Phase Diagrams[M]. USA: ASM, 1997. 2353-2359.
  • 7TOSHIHIRO YAMADA.MOTOHIRO SATOB.AKIOMI KOHNO,et al.esidual stress estimation of a silicon carbide-kovar joint[J].Journal of materials science,1991,26:2887-2892.
  • 8FUJIO TAMAI,MASAAKI NAKA.Microstructure of interface of SiC/Cu-Ag-Ti/Cu,Ni[A].Proceeding of Designing of Interfacial Structures in Aduanced Materials and Their Joints[C].Osaka:High Temperature Society of Japan,2002.634—639.
  • 9LIU Hui-jie, FENG Ji-cai, QIAN Yi-yu. Microstructure and strength of the SiC/TiAl joint brazed with Ag-Cu-Ti filler metal[J]. Journal of Materials Science Letters, 2000, 19(14): 1241-1244.
  • 10毛唯,熊华平,谢永慧,李晓红,郭万林,程耀永.两种钴基钎料钎焊SiC陶瓷的接头组织和强度[J].稀有金属,2007,31(6):766-771. 被引量:4

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