基于ANSYS的机箱热仿真及结构改进设计

Thermal Simulation and Structure Improvement Design of Chassis Based on ANSYS

随着电子设备机箱集成度的提高,内部模块热功耗越来越大。温度电子产品元器件实效因素的主要因素之一,会影响电子产品的性能及可靠性,降低设备的工作寿命。使用ANSYS有限元仿真软件可以在产品设计初期快速找出设计缺陷,更快发现结构设计中的薄弱点,最大程度上缩短产品的开发周期,降低产品的试验成本。

With the improvement of the integration of electronic equipment chassis,the thermal power consumption of internal modules is increasing.Temperature has gradually become one of the main factors for the effectiveness of electronic product components,seriously affecting the performance and reliability of electronic products,and reducing the working life of the equipment.The use of ANSYS finite element simulation software can quickly find design defects in the early stage of product design,quickly find weaknesses in structural design,minimize product development cycle,and reduce product test costs.