高密度陶瓷封装外壳电镀多余金问题若干思考

Some Thoughts on Electroplating Excess Gold of High Density Ceramic Packaging Shell

随着集成电路的发展,为了更好适应其大规模发展需求,高密度封装技术也在不断发展中得到提升。但是在发展过程中存在一些问题,本文针对高密度陶瓷封装外壳电镀多余金问题,采用现代化的测试手段,对涨金失效问题进行探究,并针对存在的问题,提出相对应的解决措施,意在推动高密度封装技术更好发展。

With the development of integrated circuits,in order to better meet the needs of large scale development,high density packaging technology has been improved in the continuous development.However,there are some problems in the development process.In this paper,aiming at the problem of electroplating excess gold in high density ceramic packaging shell,we use modern testing methods to explore the problem of gold failure and propose corresponding solutions to the existing problems,in order to promote the better development of high density packaging technology.