树脂基复合材料微胶囊自修复技术综述

Review of Microencapsulated Self-healing Technology for Resin Matrix Composite

微胶囊自修复技术通过在树脂中包埋胶囊来实现材料的快速损伤监测和起始损伤修复。本文综述了微胶囊修复技术中针对微胶囊形状和尺寸的参数优化方法。同时,综述了微胶囊在树脂基体中与裂纹作用的研究方法。分析了现有微胶囊自修复技术设计中存在的未考虑修复剂物理特性的问题。展望了未来微胶囊自修复技术与可视化材料监测及全局自修复材料技术相融合的发展前景。

Microencapsulated self-healing technology enables rapid damage monitoring and initiated damage repairing of materials by encapsulating microcapsules in resin matrix. In this paper,several methods of parameter optimization for microcapsule shape and size in microcapsule self-healing technology are reviewed. Moreover,several analytical methods for the interaction of microcapsules with cracks in a resin matrix are reviewed. The problems of the existing microencapsulated self-healing technology design that do not consider the physical properties of the repair agent are emphasized. The future development prospects of integrating microencapsulated self-healing technology with visual material monitoring and global self-healing material technology are foreseen.