基于双金属片精细建模的小型断路器热脱扣仿真及实验研究

Simulation and Experimental Study on Thermal Trip of MCB

热脱扣特性是小型断路器的一项重要指标。大多数小型断路器采用双金属片元件进行断路器的热脱扣,双金属片的形变直接影响断路器热脱扣器的工作。分析双金属片温升以及形变对小型断路器的设计具有重要意义。利用Creo软件以及有限元仿真软件Ansys建立了双金属片模型,进行有限元仿真分析,得到双金属片的瞬态温度分布以及形变分布。同时,对20组断路器进行脱扣实验,实验结果与仿真分析结果相吻合,验证了仿真方法的准确性。

Thermal trip characteristic is an important index of miniature circuit breaker(MCB).Nowadays,most MCBs use bimetallic elements for thermal tripping of circuit breakers.The deformation of bimetallic sheet directly affects the operation of thermal release of MCB.It is very important to analyze the temperature rise and deformation of bimetallic sheet for the design of MCB.At the same time,20 groups of circuit breakers are tested for tripping.The experimental results are in good agreement with the simulation results.The accuracy of the simulation method is verified.