可靠性分析中固晶胶厚度的测量方法研究

Research on Measuring Method of Bonding Layer Thickness in Reliability Analysis

集成电路生产过程中固晶胶厚度对集成电路的电性能、散热性能、分层及后续的可靠性能方面有巨大影响,因此固晶胶厚度测量是固晶生产过程中重点的控制项目,成品集成电路的可靠性分析中同样需要对固晶胶厚度进行测量,确认固晶胶厚度在控制范围内。目前的可靠性分析中,一般采用切割、打磨、抛光,再加上测量显微镜切面测量的方法,对试验过程及设备要求较高,一般企业难以满足试验要求。通过实际分析研究,采用集成电路基岛剥离方法,从芯片背面进行固晶胶厚度测量,满足一般企业控制需求,也可进行大数据时的产品可靠性研究。

The thickness of Die bonding adhesive in the assembly process of integrated circuits has a huge impact on electrical performance,for example,heat dissipation performance,delamination,and reliability of the integrated circuit.Therefore,the thickness measurement of die-bonding adhesive is the key control item in the die-bonding assembly process.In the reliability analysis of finished integrated circuit,it is also necessary to measure the thickness of die-bonding adhesive to confirm the thickness of die-bonding adhesive is within the control range.In the current reliability analysis,cutting,grinding and polishing method are generally used,coupled with measuring the cutting section by measuring microscope,this methodology has high requirements for the test process and equipment,and it is difficult for small sized enterprises to meet the test requirements.After our analysis,research and practice,using the integrated circuit lead frame peeling method to measure the thickness of die-bonding adhesive from the back of the chip,it can meet the control needs of general enterprises,and it can also be used for product reliability research with big data.