基于Rogers 5880复合介质基板的金丝楔焊键合工艺参数研究

Research on bonding process parameters of gold wire wedge welding based on Rogers 5880 composite dielectric substrate

运用正交试验法对键合效果进行了工艺参数优化方案设计和试验验证,以金丝键合强度为目标分别考察了键合功率、键合压力和键合时间3个工艺参数对键合金丝压点形态变化的影响,最终获取最优工艺参数组合为键合功率100 mW,键合时间220 ms,键合压力18 g,达到了提高金丝键合工艺可靠性的目的。

The orthogonal test method is used to design the process parameter optimization scheme and test verification of the bonding effect.With the gold wire bonding strength as the goal,the influence of the three process parameters such as bonding power,bonding pressure and bonding time on the change of gold wire pressure point morphology are studied.The optimal combination of process parameters is finally obtained with the bonding power of 100 mW,the bonding time of 220 ms,and the bonding pressure of 18 g,achieving the purpose of improving the reliability of the gold wire bonding process.