摘要
从热膨胀聚合物微球的基本组成、合成工艺、性能等方面进行概述,并详细阐述了热膨胀聚合物微球在诸如轻量化、表面修饰、隔热隔声、粘接解粘等方面的应用,并对其未来发展进行了展望。
The basic composition,synthesis process and properties of thermally expandable polymeric microsphere were summarized.The application of thermally expandable polymeric microsphere in such aspects as lightweight,surface modification,heat and sound insulation,bonding and debonding were described in details.The future development was also prospected.
作者
陈民杰
朱荣俊
杨颖
邓林盛
江一明
胡杨
Chen Minjie;Zhu Rongjun;Yang Ying;Deng Linsheng;Jiang Yiming;Hu Yang(Lescent(China)Advanced Materials Co.,Ltd.,Research Center of Fine Polymer(Lescent)Engineering and Technology of Guangdong Province,Jiangmen 529157,Guangdong,China)
出处
《中国胶粘剂》
CAS
2021年第5期65-71,共7页
China Adhesives
关键词
热膨胀聚合物微球
制备
性能
应用
thermally expandable polymeric microsphere
preparation
property
application
