退火温度对磁控溅射TiN/TiCN薄膜残余应力、结构及耐蚀性能的影响

Effect of annealing temperature on residual stress,structure and corrosion resistance of magnetron sputtering TiN/TiCN film

采用反应磁控溅射在AZ31合金上制备了TiN/TiCN薄膜,并对沉积后的薄膜进行真空去应力退火。分别采用X射线荧光光谱仪(XRF)、扫描电镜(SEM)、掠入射X射线衍射(GIXRD)和电化学工作站对退火前后的薄膜进行表面化学成分、形貌结构、残余应力以及耐蚀性能分析。结果表明:薄膜由FCC结构的TiCN和TiN组成。退火后,薄膜的晶粒尺寸和结晶度增大,内部残余应力显著下降,电化学腐蚀区域的Ti、C、N元素含量下降,250℃退火薄膜的耐蚀性能与沉积态薄膜相当,300℃退火后薄膜的耐蚀性能下降。

TiN/TiCN film was prepared on AZ31 alloy by reactive magnetron sputtering and the deposited film was subjected to vacuum stress relief annealing.X-ray fluorescence spectrometer(XRF),scanning electron microscope(SEM),grazing incidence X-ray diffraction(GIXRD)and electrochemical workstation were used to analyze the surface chemical composition,surface morphology,residual stress and corrosion resistance of all the films before and after annealing.The results show that the films are composed of TiCN and TiN with FCC structure.After annealing,the grain size and crystallinity of the films increase,the residual stress decreases significantly,the content of Ti,C and N elements in the electrochemical corrosion area decreases,the corrosion resistance of the film annealed at 250℃ is equivalent to that of the deposited film,and the corrosion resistance of the film annealed at 300℃ decreases.