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化学镀Zn对n型Bi_(2)Te_(2.4)Se_(0.6)合金热电性能的影响

Effect of Zn Electroless Plating on Thermoelectric Properties of n-type Bi_(2)Te_(2.4)Se_(0.6) Alloy
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摘要 为了研究化学镀Zn对n型Bi_(2)Te_(2.4)Se_(0.6)材料的热电性能的影响及作用机制,采用化学镀法制备n型Zn/Bi_(2)Te_(2.4)Se_(0.6)纳米粉体,并结合放电等离子烧结烧制成块体材料,n型Zn/Bi_(2)Te_(2.4)Se_(0.6)热电材料的Seebeck系数(S)提升,热导率显著降低,其中0.15%Zn/Bi_(2)Te_(2.4)Se_(0.6)的热导率最低,在371 K达到最小值0.74 W/(m·K),这是由于载流子浓度的降低引起电子热导减小,以及第二相和晶界增多引起声子散射造成晶格热导降低。结果表明,0.15%Zn/Bi_(2)Te_(2.4)Se_(0.6)的热电优值(ZT)有很大的提升,在421 K达到1.06。 In order to study the effect of electroless Zn plating on the thermoelectric properties of n-type Zn/Bi_(2)Te_(2.4)Se_(0.6) materials and its mechanism,n-type Zn/Bi_(2)Te_(2.4)Se_(0.6) nanopowders were prepared by electroless plating,and then sintered into bulk by spark plasma sintering.The Seebeck coefficient(S)of n-type Zn/Bi_(2)Te_(2.4)Se_(0.6) thermoelectric material increases and the thermal conductivity decreases significantly,among which the thermal conductivity of 0.15% Zn/Bi_(2)Te_(2.4)Se_(0.6) reaches the minimum value of 0.74 W/(m·K)at 371 K.This is due to the decrease of electron thermal conductivity caused by the decrease of carrier concentration,and the decrease of lattice thermal conductivity caused by phonon scattering caused by the increase of second phase and grain boundary.The results show that the thermoelectric figure of merit(ZT)value of 0.15%Zn/Bi_(2)Te_(2.4)Se_(0.6) is 1.06 at 421 K.
作者 王飞 李浩强 张贺 黄中月 WANG Fei;LI Hao-qiang;ZHANG He;HUANG Zhong-yue(Liquid/Solid Metal Processing Institute,School of Materials Science&Engineering,Hefei University of Technology,Hefei 230009,China)
出处 《科学技术与工程》 北大核心 2021年第13期5394-5398,共5页 Science Technology and Engineering
基金 安徽省自然科学基金(1808085ME108)。
关键词 n型Bi_(2)Te_(2.4)Se_(0.6) 热电 化学镀 放电等离子烧结 n-type Bi_(2)Te_(2.4)Se_(0.6) thermoelectric electroless plating spark plasma sintering
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