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有机磺酸盐添加剂对电镀硬铬性能的影响

Effect of Organic Sulfonate Additives on Properties of Hard Chromium Electroplating
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摘要 以有机磺酸盐作为镀硬铬添加剂,在钢铁基材上电镀硬铬,研究有机磺酸盐硬铬添加剂在最佳含量下对阴极电流效率、沉积速度、镀层硬度和微裂纹的影响。结果表明:在CrO_(3)为250 g/L、H_(2)SO_(4)为2.5 g/L、Cr^(3+)为3.2 g/L,温度为55±2℃,J_(k)为55 A/dm^(2),有机磺酸盐硬铬添加剂最佳含量为4 g/L工艺条件下,电流效率可达19.5%,平均沉积速度为54μm/h,镀层硬度大于1000 HV,镀硬铬层可形成窄而密的网状微裂纹。 The organic sulphonate was used as additive in hard chromium plating on steel substrate.The effects of organic sulphonate hard chromium additives on the current efficiency,deposition rate,hardness and micro-crack were studied.The results showed that when CrO_(3) was 250 g/L,H_(2)SO_(4) was 2.5 g/L,Cr^(3+) was 3.2 g/L,temperature was 55±2℃,current density was 55 A/dm^(2) and the organic sulphonate additives was 4 g/L,the current efficiency was 19.5%,average deposition rate was 54μm/h and hardness was greater than 1000 HV.The plated hard chrome layer can form narrow and dense network micro-cracks.
作者 刘建祥 浦建堂 周磊 叶仁祥 孙卫东 LIU Jianxiang;PU Jiantang;ZHOU Lei;YE Renxiang;SUN Weidong(Shandong Xinhai Surface Science and Technology Co.Ltd.,Linyi 276000,China)
出处 《电镀与精饰》 CAS 北大核心 2021年第6期6-9,共4页 Plating & Finishing
基金 临沂市重点研发计划(2019ZDYF021)。
关键词 硬铬添加剂 电流效率 沉积速度 硬度 微裂纹 hard chromium additives current efficiency deposition rate hardness micro-cracks
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