摘要
文章主要对超长(≥800 mm)多层分离式挠性印制板层压工艺进行研究,从优化文件设计,优化层压排板方式,优化压合参数等解决层压涨缩、层压偏移、层压白斑等常见质量问题,为后续批量化生产奠定技术基础。
This paper mainly studied the ultra-long(800mm)multi-layer separated FPC lamination process,and solved common quality problems such as the swelling and shrinkage lamination,offset lamination white spot and so on from the aspects of optimized document design,optimized lamination arrangement mode,and optimized pressing parameters,thus laid a technical foundation for subsequent mass production.
作者
张伟伟
石学兵
李波
唐宏华
樊廷慧
Zhang Weiwei;Shi Xuebing;Li Bo;Tang Honghua;Fan Tinghui
出处
《印制电路信息》
2021年第6期8-12,共5页
Printed Circuit Information
关键词
超长多层挠性电路板
层压白斑
偏移
涨缩
Ultra-Long Multilayer Flexible Circuit Board(FPCB)
Lamination White Spot
Offset
Dilation