刚挠结合印制板中挠性区的纯胶与覆盖膜黏合性探究

Study on the adhesion of pure adhesive and PI in flexible area of RFPC

有些刚挠结合印制板需要将挠性区制作成不分层结构,以防挠性区形状的改变对阻抗产生影响。不分层结构根据叠层可设计为挠性区用纯胶黏合,刚性区用半固化片黏合的混压方式生产。但直接使用纯胶粘合挠性区,存在挠性区剥离强度差、易分层的风险,故尝试探索一种有效的处理方式使得成品挠性区剥离强度符合要求,不出现分层。

Some rigid-flex PCB need to make the flexible area into non delamination structure to prevent the change of the shape of the flexible area from affecting the impedance.According to the lamination,the non-layered structure can be designed to be bonded by pure adhesive in the flexible plate and bonded by semi-cured sheet in the rigid zone.However,there are risks of poor peeling strength and easy delamination when pure adhesive is used to glue the flexible plate directly.Therefore,an effective way is trying to make the peeling strength of the flexible plate meet the requirements without delamination.