凸盘外层线路制作技术研究

Raised pad outlayer circuit fabrication technology research

凸盘技术将是下一代服务器CPU控制模块用PCB的主要应用技术之一,常见技术参数要求凸盘高度50 mm,此要求决定其PCB制作技术的重点在外层线路。文中阐述镀铜凸盘做外层线路方法,有先制作凸盘后制作线路,也有先制作出外层线路后再制作凸盘,比较了不同工艺的优缺点。

Raised pad technology is one of the main application technologies of the CPU control module substrate of the next generation PCB server.The common technical parameters require that the raised pad is 50μm high,which determines the PCB manufacturing technology to be focused on the outer circuit.In this paper,the methods of making outer circuit with copper plated raised pad are described,including making raised pad first and then making circuit,and making outer circuit first and then making raised pad.The advantages and disadvantages of different processes are compared.