ChCl-Urea低共熔溶剂中银锡合金的电沉积行为研究

Electrodeposition Behaviors of Silver-tin Alloy Coating in ChCl-Urea Deep Eutectic Solvents

以氯化胆碱-尿素(ChCl-Urea)低共熔溶剂为基础液,电沉积制备银锡合金镀层,采用循环伏安曲线、计时电流曲线对银锡合金的电化学过程进行分析,使用扫描电子显微镜(SEM)对银锡合金镀层微观形貌进行研究,利用极化曲线对银锡合金镀层的耐蚀性进行分析。结果表明,ChCl-Urea低共熔离子液体体系中,银锡的成核方式为三维瞬时成核;在不同电位条件下电沉积得到的镀层微观形貌均为枝晶状;随着沉积电位的增大,腐蚀电流减小,银锡合金镀层的耐腐蚀效果变好。

Choline chloride-urea eutectic solvent was used to study the electrodeposition of silver-tin alloy.The cyclic voltammetry curve and Chronoamperometric current transient were used to analyze the electrochemical process of the silver-tin alloy, the scanning electron microscope was used to study the microscopic morphology of the silver-tin alloy coating, and the polarization curve was used to study the corrosion resistance of the silver-tin alloy coating.A good coating was obtained under the condition of-0.85 V potential.In the ChCl-Urea eutectic ionic liquid system, the nucleation mode of silver and tin is three-dimensional instantaneous nucleation.The micro morphology of the coatings obtained by electrodeposition under different potential conditions are dendrite.With the increase of potential, the corrosion current decreases, and the corrosion resistance of silver-tin alloy coating is better.