微电子器件材料和工艺的专利分析

Patent Analysis of Materials and Processes for Microelectronic Devices

[目的/意义]面向我国信息化战略和集成电路重大需求,基于专利文献分析把握微电子器件材料和工艺的发展现状和趋势。[方法/过程]以德温特世界专利索引数据库2000-2020年的专利为基础,从三个层次进行专利分析:(1)宏观上对专利数量、时间趋势等进行基本统计分析;(2)中观上对专利国家/地区、专利权人以及研发团队合作关系等进行关联分析;(3)微观上利用Citespace分析关键材料和工艺的主题演化进程和发展趋势。[结果/结论]美国微电子器件材料和工艺专利量领先全球;全球形成以IBM-三星、日本日立和荷兰飞利浦为中心的美日欧三个研发团体,且美日间合作关系较强;传统复合材料、化合物材料已趋于成熟,新型半导体材料、纳米线、纳米管以及石墨烯及其衍生物等材料是未来研发重点。本文能弥补未总结微电子器件关键材料和工艺的研究空白,为我国相关技术发展提供参考和启示。

[Purpose/significance]Facing China's informatization strategy and major needs for integrated circuits,grasp the development status and trends of microelectronic device materials and processes based on patent document analysis.[Method/process]Based on the patents of the Derwent World Patent Index database from 2000 to 2020,the patent analysis is carried out from three levels:(1)Basic statistical analysis of the number of patents,time trends,and technology life cycles at a macro level;(2)In the middle level,conduct correlation analysis on patent application areas,patent holders,and R&D team cooperation relationships;(3)Use Citespace to analyze the theme evolution process and development trend of key materials and processes at the micro level.[Result/conclusion]The number of US microelectronic device materials and process patents leads the world;three R&D groups in the United States,Japan and Europe are formed around the world,with IBM-Samsung,Hitachi of Japan,and Philips of the Netherlands as the center,and the cooperation between the United States and Japan is strong;traditional composite materials and compound materials have become mature,and new semiconductor materials,nanowires,nanotubes,graphene and its derivatives and other materials are the focus of future research and development.This article can fill up the research gaps in the key materials and processes of microelectronic devices that have not been summarized,and provide reference and enlightenment for the research and development of related technologies in China.